Process capability
制程能力
参数 | 量产 | 样品 | 研发 |
层数 | 18 | 24 | 28 |
最小内层焊环(单边) | 5mil(0.13mm) | 4.5mil(0.11mm) | 4.0mil(0.10mm) |
板厚 | 0.5-3.2mm | 0.4-3.2mm | 0.3-4.0mm |
最小线宽/间距 | 内层:2.5mil/2.5mil外层:3.0mil/3.0mil | 内层:2.0mil/2.0mil外层:2.5mil/2.5mil | 内层:2.0mil/2.0mil外层:2.5mil/2.5mil |
最小机械钻孔孔径 | 0.15mm | 0.10mm | 0.10mm |
最小镭射钻孔孔径 | 0.10mm | 0.075mm | 0.075mm |
纵横比 | 10:1 | 12:1 | 13:1 |
最小阻焊桥 | 3.0mil(75μm) | 2.5mil(64μm) | 2.0mil(50μm) |
阻焊最小开窗 | 2mil | 1.5mil | 1.5mil |
塞油最大孔径 | 0.50mm | 0.60mm | 0.80mm |
孔到线最小距离 | 6mil(0.15mm) | 5.5mil(0.14mm) | 5.5mil(0.14mm) |
阻抗公差控制 | ±10%(差分、特性测试) | ±8%(差分、特性测试) | ±5%(差分、特性测试) |
HDI阶数 | 2阶 | 3阶 | 4阶 |
表面处理 | 沉金、喷锡、OSP、沉锡 | 沉金、喷锡、OSP、沉锡 | 沉金、喷锡、OSP、沉锡 |